§ 11-03 Hazardous Content of Electronic Devices.
RCNY § 11-03
(a)No new cathode ray tube, product containing a cathode ray tube, liquid crystal display (LCD), plasma screen or other flat panel television or computer monitor or similar video display product, desktop computer or laptop computer, computer peripheral including, but not limited to, a keyboard, mouse and other pointing device, printer, scanner, facsimile machine and card reader, copier, and multi-function device shall contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers, except that this section shall not apply to: (1) Any battery, medical device or monitoring and control instrument.
(2)Any display device with a diagonal screen size of four inches or less.
(3)Any electronic device that is functionally or physically a part of any larger piece of equipment designed and intended for use in an industrial, commercial or medical setting, including diagnostic, monitoring or control equipment.
(4)Any remanufactured, refurbished or reused electronic device; any electronic device containing any reused component, assembly or part; and any reused part, component or assembly for the repair of any electronic device.
(5)Any electronic device used in homeland security, police, military or emergency response activities, and/or by personnel engaged in those activities.
(6)Mercury in the following circumstances: (i) In compact fluorescent lamps not exceeding 5 mg per lamp; (ii) In straight fluorescent lamps for general purposes not exceeding: – halophosphate 10 mg – triphosphate with normal lifetime 5 mg – triphosphate with long lifetime 8 mg; (iii) In straight fluorescent lamps for special purposes; and (iv) In other lamps not specifically mentioned in this section.
(7)Lead in the following circumstances: (i) 0.1% by weight in homogeneous materials; (ii) As a constituent in the glass used in cathode ray tubes, electronic components or fluorescent tubes; (iii) As an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight; (iv) In high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead); (v) In solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications; (vi) In electronic ceramic parts (e.g. piezoelectronic devices); (vii) In lead-bronze bearing shells and bushes; (viii) Used in compliant pin connector systems; (ix) As a coating material for the thermal conduction module c-ring; (x) In solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight; (xi) In solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages; (xii) In linear incandescent lamps with silicate coated tubes; (xiii) Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications; (xiv) As activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb); (xv) With PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL); (xvi) Lead oxide in glass used for bonding front and rear substances of flat fluorescent lamps used for Liquid Crystal Displays (LCD); (xvii) As an impurity in RIG (rare earth iron garnet) Faraday rotators used for fiber-optic communications systems; (xviii) In finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames; (xix) In solders for the soldering to machined through hole discoidial and planar array ceramic multilayer capacitors; (xx) Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes; (xxi) Lead oxide in the glass envelope of Black Light Blue (BLB) lamps; (xxii) Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers; and (xxiii) Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council of the European Union Directive 69/493/EEC, as amended.
(8)Cadmium in the following circumstances: (i) 0.01% by weight in homogeneous materials; and (ii) Cadmium and its compounds in electrical contacts and cadmium plating.
(9)Lead and cadmium in the following circumstances: (i) In optical and filter glass; and (ii) In printing inks for the application of enamels on borosilicate glass.
(10)Hexavalent chromium in the following circumstances: (i) As an anti-corrosion of the carbon steel cooling system in absorption refrigerators; and (ii) Until July 1, 2007, in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of European Union Directive 2002/96/EC (IT and telecommunications equipment).
(11)The following materials in the following concentrations: (i) 0.1% by weight in homogeneous materials for mercury; (ii) 0.1% by weight in homogeneous materials for hexavalent chromium; (iii) 0.1% by weight in homogeneous materials for polybrominated biphenyls; and (iv) 0.1% by weight in homogeneous materials for polybrominated diphenyl ethers.
(12)DecaBDE in polymeric applications.
(b)[Reserved.]
